Magnetron Sputtering System

Sputtering is a vacuum evaporation process which physically removes portions of a coating material called the target, and deposits thin, firmly bonded onto an adjacent surface called the substrate.

The process occurs by bombarding the surface of the sputtering target with gaseous ions under high voltage acceleration. As these ions collide with the target, atoms or occasionally entire molecules of the target material are ejected and propelled against the substrate, where they form a very tight bond. The resulting coating is held firmly to the surface by mechanical forces, although, in some cases, and alloy or chemical bond may result. Since the coating material is passed into the vapor phase by a mechanical rather than a chemical or thermal process, virtually any material can be deposited. Direct current is used to sputter conductive materials.

DC magnetron sputtering system can deposit catalyst particles like Iron, Nickel, Cobalt etc on substrate materials for the growth of carbon nanotubes.