Details

RF Magnetron Sputtering is a physical vapor deposition (PVD) technique used to deposit thin films by bombarding a target material with high-energy ions generated by radio-frequency (RF) plasma, causing atoms to eject and form a thin, uniform coating on a substrate. It is especially suitable for depositing insulating (non-conductive) materials such as oxides, nitrides, and ceramics.

 

Model and Make

 RF Magnetron Sputtering- Advanced Process Technology, India

Specifications

Key Features:

 

  • Suitable for Non-conductive Targets
  • Magnetron Enhancement
  • High Film Uniformity
  • Precise Control
  • Low Substrate Temperature
  • Reactive Sputtering Capability
  • Excellent Purity & Adhesion
  • Versatile Material Choice

 

Applications:
 
  • Semiconductor Manufacturing
  • Thin-Film Solar Cells
  • Optical Coatings
  • Hard & Protective Coatings
  • Battery and Supercapacitor Materials
  • Micro- and Nano-Electronics
  • Research & Material Science