Laser Flash Apparatus

Ultrasonic soldering system combines heat and ultrasonic vibration to enable the soldering on glass, ceramics, aluminium, stainless steel and other unsolderable substrates. Solder is bonded to the substrate without using any chemical agents; hence the whole soldering process is flux free. The resulting joints have a high degree of electrical conductivity, adhesive strength, air/water tightness, weather and humidity resistance.